Materials Science and Engineering

Study mode:On campus Study type:Full-time Languages: English
Foreign:$ 4.77 k / Year(s)  
401–500 place StudyQA ranking:4460 Duration:2 years

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Materials Science and Engineering at Harbin Institute of Technology is a comprehensive and highly regarded program designed to equip students with the fundamental knowledge and practical skills necessary to innovate and excel in the development, processing, and application of various materials. This program integrates interdisciplinary principles of physics, chemistry, and engineering, focusing on the structure-property relationships of metals, ceramics, polymers, composites, and advanced functional materials. Students are trained to analyze material behaviors under different conditions and to utilize advanced characterization and fabrication techniques. The curriculum emphasizes both theoretical understanding and hands-on laboratory experience, encouraging students to engage in research projects and industry collaborations. Throughout their studies, students explore cutting-edge topics such as nanomaterials, biomaterials, smart materials, and materials for energy applications, preparing them to address modern technological challenges. The program also aims to foster innovation, critical thinking, and teamwork skills, enabling graduates to contribute to technological advancements as engineers, researchers, or entrepreneurs. With access to state-of-the-art laboratories, a distinguished faculty team, and strong links with industry partners, students gain a well-rounded education that combines academic excellence with practical relevance. Upon graduation, students are equipped to pursue careers in manufacturing, product development, quality control, and scientific research within a variety of sectors including aerospace, automotive, electronics, biomedical, and environmental industries. The program upholds Harbin Institute of Technology’s commitment to nurturing talented professionals who can lead advancements in materials science and engineering locally and globally.

Degree Courses

  • Chinese culture and cross-cultural communication
  • Numerical Analysis
  • Equations of Mathematics and Physics 
  • Thermodynamics and Kinetics of Materials
  • Solid state phase transformation
  • Surfaces and Interfaces in Materials
  • Space Environmental Effects of Materials
  • Numerical heat transfer and fluid flow
  • Plastic forming technique and numerical simulation
  • Hydroforming technology and process control
  • Interfacial behavior of joining and bonding
  • Fundamentals of Microjoining in Electronics Packaging Technology
  • Advanced Materials Characterization Techniques

Optional Courses

  • Synthesis and properties of nanomaterials
  • Fundament of Semiconductor -device Physics 
  • Ceramic Materials
  • Physics and Chemistry of Materials Surface
  • Biomaterials
  • TiAl intermetallic and titanium matrix composites
  • Advanced Laser Welding Technology
  • Finite element analysis for heat transfer, stress and deformation
  • High energy beam welding
  • Space Tribology 
  • Smart Nanocomposites 
  • Scanning probe Microscopy
  • Fabrication of new materials

Special Topic

  • Special Topic Courses

Required Parts

  • Academic Communication
  • Thesis Proposal 
  • Interim Inspection  

Requirements

  • Applicants must be foreign nationals in good health.
  • Applicants must have bachelor’s degree. 
  • HIT Application for Admission to Degree Program
  • Notarized copy of Bachelor’s degree (Chinese or English) 
  • Notarized undergraduate transcript (Chinese or English) 
  • Two letters of recommendation in Chinese or English from professors
  • Study Plan more than 800 words (See Attachment I)
  • Copy of Passport 
  • Language requirement for Chinese-medium Programs: Recent HSK-4 or above, or pass the Chinese Entrance Examination organized by university.
  • Language requirement for English-medium Programs: TOEFL 80, IELTS 5.5 or above, or pass the English Entrance Examination organized by university.
  • The recent Physical Exam Certificate.

Scholarships

  • Chinese Government Scholarship Program
  • HIT Scholarship
  • HIT-Qingrui Scholarship for International Students
  • Special Fund for International Academic Conferences

Registration fee: 400 RMB (Test fee 200RMB)
Housing fee: 600 RMB/month/bed (excluding electricity fee)  
Insurance fee: 800 RMB /year 

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